Intel’s 3D-stacked Lakefield processors are finally getting an official debut after months of previews, promising to bring a smaller, more versatile chipset option to hardware manufacturers for new ...

Three years ago, Intel engineer Wilfred Gomes and his colleagues sat down to decide how the future should look. The team had just finished its work on Intel's next-generation high-performance and ...

Chipset manufacturer Intel launched new hybrid processors which have been codenamed Lakefield. These chipsets are made for next-gen PCs with foldable and dual screen devices of the future The Intel ...

Intel has kicked off the hype train for its next-gen Lakefield processor, which will be the first to use Intel's new Foveros 3D packaging technology, and will start production later in the year. The ...

The 10 nanometer i3 and i5 "Sunny Cove" hardware will handle heavier workloads, while less demanding tasks move over to the Atom cores, similar to the “big.Little” arrangement Qualcomm uses. And ...

The first batch of Intel Lakefield chips include the Core i5-L16G7 and the Core i3-L13G4. Intel is ready to take on ARM and by extension, Qualcomm, Samsung, and Huawei, in a big way. On Wednesday ...

Intel also showed off new 5G devices and announced more 9th-generation Core processors, but didn't offer concrete updates on its move to a 10-nanometer production process for PCs. I’m the deputy ...

Share on Facebook (opens in a new window) Share on X (opens in a new window) Share on Reddit (opens in a new window) Share on Hacker News (opens in a new window) Share on Flipboard (opens in a new ...